ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,397, issued on April 14, was assigned to CANATU OY (Vantaa, Finland). "Method of manufacturing a formed film" was invented by Ilkka Varjos... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,397, issued on April 14, was assigned to CANATU OY (Vantaa, Finland). "Method of manufacturing a formed film" was invented by Ilkka Varjos... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,398, issued on April 14, was assigned to The Regents of the University of Colorado, a body corporate (Denver). "Self-healable, recyclable,... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,398, issued on April 14, was assigned to The Regents of the University of Colorado, a body corporate (Denver). "Self-healable, recyclable,... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,399, issued on April 14, was assigned to Sumitomo Electric Industries Ltd. (Osaka, Japan). "Substrate for printed wiring board and printed... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,399, issued on April 14, was assigned to Sumitomo Electric Industries Ltd. (Osaka, Japan). "Substrate for printed wiring board and printed... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,400, issued on April 14, was assigned to CISCO TECHNOLOGY INC. (San Jose, Calif.). "Via and pad arrangement for printed circuit board" was... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,400, issued on April 14, was assigned to CISCO TECHNOLOGY INC. (San Jose, Calif.). "Via and pad arrangement for printed circuit board" was... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,401, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Film package and package module including ... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,401, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Film package and package module including ... और पढ़ें